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| 1. general description the uba20261/2 are high-voltage power integr ated circuits designed to drive and control high powered self-ballasted compact fluore scent lamp (cfl) lighting applications operating at mains supply voltages of 120 v or 230 v. the ic includes a half-bridge power circuit consisting of two nmost power mosfet s, an advanced feature for step dimming and a lamp current controlled boost feature for boosting cold (amalgam) cfls. the controller contains a cfl half-bridge driv e function, a high-voltage level-shift circuit with integrated bootstrap diode, an oscillator function, a cu rrent control function for preheat and burn, a timer function and prot ection circuits. the uba20261/2 are supplied using the dv/dt current charge supply circuit from the half-bridge circuit. remark: the mains voltages given in this data sheet are ac voltages. 2. features and benefits 2.1 half-bridge features ? uba20261: two internal 350 v, 1 ? , maximum 5 a nmost half-bridge power mosfets ? uba20262: two internal 600 v, 3 ? , maximum 2.7 a nmost half-bridge power mosfets ? integrated high-voltage level-shifter function with integrated bootstrap diode 2.2 preheat and ignition features ? coil saturation protection during ignition ? adjustable saturation protection level ? adjustable preheat time ? adjustable preheat current ? ignition lamp current detection 2.3 lamp boost features ? adjustable boost timing ? fixed boost current ratio of 1.5 ? gradually boost to burn transition timing uba20261/2 600 v and 350 v power ic for step dimmable cfls rev. 2 ? 10 october 2011 product data sheet
uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 2 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 2.4 dim features ? 4-level step dimming adjustment using a standard on/off mains switch ? adjustable memory retention time for step dimming ? adjustable minimum dimming level 2.5 protection ? overtemperature protection (otp) ? capacitive mode protection (cmp) ? overpower prot ection (opp) ? overcurrent protection (ocp) in both boost and burn states ? power-down function 2.6 other features ? current controlled operation in both boost and burn state ? external power-down option 3. applications ? uba20261: step-dimmable compact fluorescent lamps at power levels between 5 w and 20 w operating at 120 v mains voltage ? uba20262: step-dimmable compact fluorescent lamps at power levels between 5 w and 20 w operating at 230 v mains voltage 4. ordering information table 1. ordering information type number package name description version UBA20261T/n1 so20 plastic small outline package; 20 leads; body width 7.5 mm sot163-1 uba20262t/n1 so20 plastic small outline package; 20 leads; body width 7.5 mm sot163-1 xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 3 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 5. block diagram fig 1. block diagram bootstrap fs logic preheat current sensor v ph(sls) 25 a ignition current detector v th(det)ign(csi) logic inductor saturation/ overcurrent detector pgnd step dim level select q a q b n.c. level shifter hs driver ls driver capacitive mode detector reference current 1.27 v 25 a rref cf ci csi frequency control logic dsr ota lamp current sensor boost amplifier voltage controlled oscillator i v reset state start-up state preheat state ignition state hold state boost state burn state power-down state temperature sensor 160 120 80 divide by 2 logic driver logic v dd supply reference voltages 5 v digital 5 v analog 5 v 1 a 6 a logic counter preheat/ boost timer reset + - + - + - + - + - + + - - + - + - + - 60 a 5 v digital memory cp cb 14 step dimmer logic v th(capm)sls v th(ocp)sls 001aam982 mdl v clamp(csi) ?v dim2(csi) ?v dim3(csi) v mdl v dim_3 v dim_2 v dim_1 13 6 16 5 sgnd 15 12 9 11 10 8 7 4 2 v dd(stop) state logic ghs gls sls dhs 18 1 sls sls hbo 17 19 20 hbo hbo 2 3 lsat4 uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 4 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 6. pinning information 6.1 pinning 6.2 pin description [1] the sls pins are internally connected. [2] the pgnd and sgnd pins are internally connected. [3] the hbo pins are internally connected. fig 2. pin configuration for uba20261/2 (sot109-1) uba20261/2 sls hbo sls hbo sls dhs lsat hbo pgnd fs v dd sgnd rref cb cf cp mdl n.c. ci csi 001aao278 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19 table 2. pin description symbol pin description sls 1, 2, 3 source low-side switch [1] lsat 4 coil saturation level input pgnd 5 power ground [2] v dd 6 low voltage supply rref 7 internal reference current input cf 8 voltage controlled oscillator capacitor mdl 9 minimum dimming level input ci 10 voltage controlled oscillator input integrating capacitor csi 11 current feedback sense input n.c. 12 not connected cp 13 preheat timing capacitor cb 14 boost timing capacitor sgnd 15 signal ground [2] fs 16 floating supply voltage hbo 17, 19, 20 half-bridge output; open output [3] dhs 18 high-voltage supply; drain high-side switch uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 5 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 7. functional description the uba20261/2 are ics with integrated half-bridge mosfets in self-ballasted high-power cfls. the uba20261/2 have no di mming control input but instead, four preset fixed dimming levels. only minor adjustment of the presets is possible. the uba20261/2 are rated up to a maximum continuous rectified mains voltage of 350 v or 500 v, respectively and lamp power-up to 20 w. the uba20261/2 includes all functions necessary for preheat, ignition and boost ope ration of the lamp. in addition, the ic includes the four-step dimming feature and several protective features to safeguard cfl operation. the controller states are shown in figure 3 . (1) v dd < v dd(start) and (hold = 0 or v cp < v th(rel)cp ). (2) v dd < v dd(stop) . (3) (end of ignition time and hold = 0) or v dd uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 6 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 7.1 lamp start-up cycle 7.1.1 reset state the uba20261/2 are in the reset state when the supply voltage on the v dd pin is below the v dd(rst) level. in the reset state, part of the internal supply is turned off and all registers, counters and timers are undefined. the hold st ate latch is reset and both the high and low side power transistors are non-conductive. during power-up, the low voltage supply capacitor on the v dd pin is charged through the external start-up resistor. the start-up state is entered when the voltage on the v dd pin is above the v dd(rst) level. the uba20261/2 enters the reset state when the supply voltage on the v dd pin drops below v dd(rst) . 7.1.2 start-up state the start-up state is entered by charging the low voltage supply capacitor on the v dd pin through the external start-up resistor. at start-up, the high-side (hs) transistor is non-conductive and the low-side (ls) transist or is conductive to enable charging of the bootstrap capacitor. this capacitor supplie s the hs driver and level shifter circuit connected between the fs and hbo pin. a dc reset circuit is integrated into the hs driver. this circuit ensures that below the fs pin lockout voltage, the output voltage v ghs ? v hbo is zero. when the start-up state is ente red, the circuit only starts oscillating when the low voltage supply (v dd ) reaches the v dd(start) value. the circuit always starts oscillating at f bridge(max) . the circuit enters the preheat state as soon as the capacitor connected to the cp pin is charged above the v th(cp)max voltage level. to keep oscillating, v dd must be above v dd(stop) and below the v dd(clamp) upper limit. during the start-up state, the voltage on the cf pin is zero and on the cb pin is close to zero. the voltage on the cp pin rises just above v th(cp)max during the start-up state as shown in figure 9 . 7.1.3 preheat state after starting at f bridge(max) , the frequency decreases by charging capacitor c ci using an output current circuit. the preheat current sensor circuit contro ls the current output circuit, until the momentary value of the voltage across sense resistor r sls reaches the fixed preheat voltage level (sls pin). at this level, the current of the preheat current sensor reaches the charge and discharge balanced state on capacitor c ci to set the half-bridge frequency. the preheat time consists of eight saw-toot h pulses at the cp pin. the preheat time begins as soon as the capacitor on the cp pin is charged above v th(cp)max value. during the preheat time, the current feedback sens or circuit (input csi pin) is disabled. to increase noise immunity, an internal filter of 30 ns is included at the sls pin. if the level on the v dd pin drops below v dd(stop) during preheat, the preheat state is immediately stopped and the circuit enters th e hold state. the hold state delays a new preheat cycle by a fixed delay time. a fixed voltage drop on the preheat capacitor c cp and the fixed discharge current on the cp pin are used to set the delay time. uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 7 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls new preheat cycles start after the cp pin level slowly discharges until v cp uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 8 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 7.1.5 boost state and transition to burn state when ignition is detected, by measuring lamp current on the csi pin, the circuit enters the boost state. figure 7 shows the boost and burn state in mo re detail. in the boost state, the nominal burn state lamp current can be increa sed with a fixed boost ratio of 1.5 : 1. this ratio boosts the slow luminescence increase of a cold amalgam cfl lamp, provided the ic is in the dim_1 mode. if the ic is at a temperature (t j(bp)bst ) before entering the boost state, the burn state is bypassed. a boost timing circuit is included to determine the boost time and transition to burn time. the circuit consists of a clock generator comprising c cb , r ext(rref) and a 64-step counter. when the timer is not operating, c cb is discharged below the v th(cb)min level of 1.1 v. this voltage, approximately 0.6 v, is still higher than the level at whic h the comparator on c cb detects if the cb pin is shorted to ground. the boost time consists of 63 saw-tooth puls es on the cb pin, automatically followed by the transition time at the cp pin. the 32 sa w-tooth pulses form the transition time from boost to burn and enables a smooth transition between the current controlled boost and burn state. the total transition time is approximately four times the preheat time (see figure 6 ). fig 5. retry cycle 001aan537 voltage (v) v cp v th(cp)max 5 v 0 v v th(cp)min v th(rel)cp t ph t ph restart delay time startup time t en(ign) t en(ign) 2 nd startup t d(restart) discharge to 0 v time (s) 1 st preheat time 1 st ignition enabling time 2 nd ignition enabling time 2 nd preheat time 2 nd failed ignition attempt 1 st failed ignition attempt power down state hold state uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 9 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls in the boost state, a lamp current feedback control is implemented to improve lamp stability (see section 7.1.6 ). the lamp current has a fixed ratio of 1.5 compared to the burn state to boost the slow luminescence increase of a cold cfl lamp. in the boost to burn transition time, there is a slow 15-s tep ratio decrease from 1.5 down to 1. the preheat timer is reused for the transition to burn time and the boost ratio is gradually decreased in 15 steps from 1.5 to 1, within 32 saw-tooth pulses on the cp pin. using the application values for c cb and r ext(rref), a boost time of more than 300 s is possible. in addition to boost bypass at a temperature of t j(bp)bst ( ? 80 ? c), a temperature protection function is implemented during boost state of t j(end)bst ( ? 120 ? c). if the temperature passes this level during boost, the transition timer is immediately started to enter the burn state faster. effectively this reduces the boost time (see figure 4 [b]). the boost state current boost does not start in dim modes dim_2, dim_3 or mdl (see figure 4 [a]). remark: if the cb pin is short circuited to ground, the boost function is disabled. in such a situation, the bottom frequency f bridge(min) is 1.8 times higher than the boost bottom frequency f bridge(bst)min . 7.1.6 burn state after the boost state or when it is bypassed, the burn state starts. the lamp current sensor circuit remains enabled (see figure 4 [a]). the voltage across sense resistor r csi , is measured by the csi (current sense input) pin. it is then passed through a double-sided rectifier (dsr) circuit and fed towards an operational transconductor amplifier (ota). when the rms voltage on the csi pin reaches the actual internal reference level, the lamp current sensor circuit takes over control of the lamp current. the internal current output of the ota is transferre d using an integrator on the ci pin to the input for voltage controlled oscillator (vco). th e vco regulates the frequency and as a result, the lamp current. fig 6. boost timing 001aam765 voltage (v) 5 v v cb v cp v th(cp)max 4.5 v v th(cp)min 3.8 v v th(cb)max 3.6 v v th(cb)min 0.6 v 1 ignition boost transition burn time (s) 132 2616263 0 v 1.1 v uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 10 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 7.1.7 hold state the hold state is a special state that reduces lamp flicker at deep dim levels, on or near dim and ignition threshold levels. the ic enters the hold state after an ignition failure or when the low supply voltage v dd drops below v dd(stop) in the ignition or preheat states (see figure 3 ). a repeated drop in supply voltage below v dd(stop) in preheat or ignition states, does not increment the ignition attempt counter. the ho ld state is entered, delaying a new preheat cycle with the same time delay/mechanism by the hold state retention time as shown in figure 5 . when cp is below v th(rel)cp , the ic is released from the hold state and moves to the start-up state as shown in figure 3 . alternatively, the hold state ends when the supply voltage drops below v dd(rst) and the ic is reset. with a 470 nf capacitor on the cp pin, the typical hold state retention delay is between 1 s and 1.7 s. this delay is dependent on wh ere the preheat cycle was cut-off on the rising or falling edge of the preheat ti ming. the retention time for a failed ignition always starts from the top of the rising edge on the cp pin (see figure 5 ). in the hold state, a hold state latch is se t (hold state latch = 1) and the oscillator is stopped. in addition, the hs transistor is non-conductive and the ls transistor is conducting. the voltage on the v dd pin alternates between v dd(start) and v dd(stop) until the voltage on the cp pin reaches v th(rel)cp (see figure 5 ). the alternating supply voltage is caused by the current drawn by the ic supply pin v dd . the supply current is less than 220 ? a, when fig 7. boost and burn state machine 001aam767 boost and burn states 01 boost boost timer running boost_ratio = 1 boost_ratio = 1.5 11 boost transition 00 burn select 10 burn v i(csi) = v otp(csi) (66 % level) v i(csi) = v damp(csi) (100 % level) temp < t j(otp) - t j(otp)(hys) not (boost or boost transition) dim_1 state and boost temp > t j(bp)(bst) or boost_disable temp > t j(end)bst or boost timer ended boost_transition timer ended or temp > t j(otp) temp < t j(bp)bst and not boost_disable temp > t j(otp) uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 11 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls the supply voltage v dd rises between v dd(stop) and v dd(start) . typically, the supply current is 2 ma when v dd falls between v dd(start) and v dd(stop) . more current is drawn during the fall in v dd because the internal analog supply is turned on when v dd >v dd(start) . this function enables the comparators to monitor the voltage on the cp pin and if the supply voltage v dd falls below v dd(stop) . 7.2 oscillation and timing 7.2.1 oscillator control the internal oscillator is a vco which ge nerates a saw-tooth waveform between the v th(cf)max level and 0 v. capacitor c cf , resistor r ext(rref) and the voltage on the ci pin determine the saw-tooth frequency. r ext(rref) and c cf determine the minimum and maximum switching frequencies. their ratio is in ternally fixed. two ratios are available, the ratio between f bridge(max) and f bridge(min) is 2.5 and the ratio between f bridge(max) and f bridge(bst)min is 4.6. the saw-tooth frequency is twice the half-bridge frequency. transistors hs (q1) and ls (q2) are swit ched to conducting at a duty cycle of approximately 50 %. an overview of the oscilla tor signal and driver signals is shown in figure 8 . the oscillator star ts oscillating at f bridge(max) . the non-overlap time between the gate driver signals v gls and v ghs is t no . 7.2.2 combined timing circuit a combined timing circuit is used to determi ne the preheat time, ignition enabling time and overcurrent time (see figure 9 ). c cp , r ext(rref) and the counter comprise the clock generator circuit. when the timer is not running, c cp is charged to 5 v. the timing circuit fig 8. saw-tooth, gate driver and half-bridge output signals 001aam766 0 t dch 0 0 0 v cf voltage (v) v (ghs-hbo) v gls v hbo t no time (s) t no uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 12 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls starts operating after the start-up state when the v dd supply voltage has reached v dd(start) and the voltage on the cp pin passes v th(cp)max . the preheat time consists of eight saw-tooth pulses on the cp pin as shown in figure 9 . the maximum ignition enabling time after the preheat phase is two complete saw-tooth pulses. during the boost and burn state, pa rt of the timer is used to generate the maximum overcurrent time (more than one half of the saw-tooth pulse). if a continuous overcurrent is detected, the timer starts. 7.3 step dimming the uba20261/2 uses the step dimming method of dimming a lamp load. this method enables the lamp to operate in four different light output level modes including full power. the four different dim level modes can be select ed by toggling the supply voltage which is made possible by toggling the mains voltage switch. to change the dim step, the low supply voltage must be above v dd(start) . in addition, the voltage must drop below v dd(rst) , irrespective of whether the ic is in the preheat, ignition, boost or burn states (see figure 10 ). the discharge time of capacitor c cp (while the v dd power supply is off) sets step memory retention time. when the voltage on the cp pin drops below v ret(dim)cp (2 v typical), the step memory is lost. the next time the suppl y is powered on, the la mp turns on at full brightness. using the default components, the retention time is ? 3 s. the retention time calculation can be found in section 11 on page 23 . fig 9. timing diagram for preheat, ignition and overcurrent 001aam768 voltage (v) 5 v 0 v 4.5 v 3.8 v v cp startup time preheat time boost-burn power down overcurrent fault time cfl ignition ignition time ignition enabling time time (s) v th(cp)max v th(cp)min uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 13 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls four internal references determi ne the actual internal set point levels used for the different step dim levels. depending on the selected dim level, the current control feedback loop regulates the voltage on the csi pin. in this way, it ensures that v i(csi) is equal to one of the selected internal set point voltages. the sequence of the four dim steps shown in figure 11 is as follows: ? the lamp is switched off longer than the memory retention time: the ic starts up in the dim_1 mode (lamp is 100 % on, no dimming) ? after lamp off/on toggling, the ic twice enters dim_2 mode: the lamp is dimmed to approximately 66 % (1) of its initial light output ? the next lamp off/on toggling, the ic enters dim_3 mode: the lamp is dimmed approximately 33 % (1) of its initial light output ? toggling the lamp off/on again: the ic enters the mdl (minimum dimming level) mode. this level equals approximately 10 % (1) of the initial light output ? renewed toggling enters the dim_1 mode again. where (1) = r mdl = 2 k ? fig 10. supply voltage cycle for dim step change 0 v dd(rst) v ret(dim)cp v dd(stop) v dd(start) 5 lamp on old dim level lamp on new dim level dim step change lamp off v dd v cp voltage (v) time (s) 001aam769 start-up retention uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 14 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls as the internal step reference voltages are independent from the mains voltage, the lamp current output is kept consta nt. making the lamp current output not susceptible to line voltage fluctuations. the mdl level sets the minimum lamp current level and is adjusted using the mdl pin. an accurate minimum dimming voltage level is set using an internal reference current and an external resistor r mdl . the internal reference current is derived from the internal band gap reference circuit and resistor r ext(rref) . the other two step dimming levels are set at a fixed voltage offset referenced to the adjusted mdl level. this means that these levels shift by the same voltage as the mdl shifts. when the mdl level is at the default level, the light output in dim_2, dim_3 and mdl modes is approximately 66 %, 33 % and 5 % from nominal. 7.4 protection functions and power-down mode 7.4.1 coil saturation protection csp is integrated into the ic to allow the use of small cf l lamps and use of small coils. saturation of these coils is detected and e xcessive overcurrent due to saturation is prevented. csp is only enabled during the ignition state. a cycle-by-cycle control mechanism is used to limit voltages and currents in the resonant circuit when there is no or delayed ignition. it prevents coil saturation, limits high peak currents and the dissipation in the half-bridge power transistors. coil saturation is detected by mo nitoring the voltage across the r sls resistor. a trigger is generated when this voltage exceeds the v th(sat)sls level. when saturation is detected, a fixed current ? i o(sat)cf is injected into the c cf capacitor to shorten the half-bridge fig 11. voltage on the csi pin as function of dim step 0 001aam770 1.2 1.0 0.8 0.6 0.2 v i(csi) = v mdl v clamp(csi) internal clamp v dd off-on toggle ?v dim2(csi) v dd off-on toggle (1) = v dd off-on toggle ?v dim3(csi) v i(csi) v rms 0.4 dim_2 dim_1 100 % dim_3 mdl (1) (1) uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 15 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls switching cycle. the injected cu rrent is maintained until the end of the switching cycle. this action immediately increases the half-bridge switching frequency. additionally, for each successive cycle that coil sa turation is detected, capacitor c ci discharges enabling ignition time-out detection in the ignition state. csp is triggered when the voltage on the sls pin exceeds v th(sat)sls (typically 2.5 v). the voltage v i(sls) on the sls pin is determined by the external resistor r sls value and also sets the preheat current. using an internal reference source current and external resistor r lsat , an accurate setting for the coil saturation threshold level v th(sat)sls is possible. when resistor r lsat is not mounted, the v th(sat)sls level is internally clamped at 2.5 v. it is mandatory for stability reasons to connect c lsat in parallel to r lsat even when r lsat is not mounted. 7.4.2 overcurrent protection ocp is active in both the burn and boost states but not during boost transition. overcurrent is detected, when the peak voltage of the absolute value across the current sense resistor connected to the sls pin exceeds the ocp reference level v th(ocp)sls . a current i o(cp) is then sunk from the capacitor connected to the cp pin for the next full cycle. if overcurrent is not present at the end of th is cycle, the current is disabled. a current, equal to i o(cp) is sourced to the cp pin instead. if overcurrent occurs in more than half the number of cycles, a net discharging of the capacitor connected to the cp pin occurs. when the voltage on the cp pin drops below v th(cp)min , the ic enters power-down mode. during a continuous overcurrent condit ion, the overcurrent fault time of t fault(oc) takes ? 1 9 t ph after which the ic enters power-down mode. the v th(ocp)sls level is the same as the v th(sat)sls level during the ignition state. 7.4.3 overpower protection opp is active in the boost and burn state. th e lamp current is limited and regulated in all dim step states to the internal dim step reference voltage levels. these reference voltage levels are derived from an internal reference voltage. consequently, supply voltage fluctuations in the mains supply voltage during overvoltage situations do not affect these reference voltage levels. when the lamp is in the first dim mode (no dimming), the current is limited and regulated to the nominal lamp current. in addition, in the boost state, the first dim mode boosted by a factor of 1.5. 7.4.4 capacitive mode protection cmp is active in the ignition, burn and boost states and during boost transition. the signal across resistor r sls also provides information about the half-bridge switching behavior. when conditions are normal, the current flows from the ls transistor source to the half-bridge when the ls transistor is switched on. this results in a negative voltage on the sls pin. as the circuit yields to capacitive mode, the voltage becomes smaller and eventually reverses polarity. cmp prevents this action by checking if the voltage on the sls pin is above the v th(capm)sls level. uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 16 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls if the voltage across resistor r sls is above the v th(capm)sls threshold when the ls transistor is switched on, the circuit assume s that it is in capacitive mode. when capacitive mode is detected, th e currents from the ota, which normally regulate the lamp current, are disabled. then the capacitive mode sink current i o(ci) is enabled. the capacitive mode sink curr ent starts to discharge the capacitor/resistor circuitry on the ci pin and as a result, gradually increases the half-bridge frequency. discharging continues for the remainder of the current swit ching cycle ensuring the total current on the ci pin is equal to the sink current. if capaci tive mode persists, the action is repeated until capacitive mode is no longer detected. if capacitive mode is no longer detected, the ota takes over the regulation again. if the conditions causing capacitive mode per sist, ota regulates th e system back towards capacitive mode and the protection takes over again. the system operates on the edge of capacitive mode. when in the boost and burn states, the half-bridge load is capacitive at higher frequencies, cmp eventually drives the half-bridge to the maximum frequency f bridge(max) . this causes the ic to enter power-down mode. 7.4.5 overtemperature protection the otp circuit is designed to prevent th e device from overheating in hazardous environments. the circuit is triggered wh en the temperature exceeds the maximum temperature value t j(otp) . otp changes the lamp current to the level equal to the v otp(csi) level. this condition remains until the temperature decreases by ? 20 ? c=t j(otp)hys . after this decrease in temperature, the lamp cu rrent level returns to the nominal level. 7.4.6 power-down mode power-down mode is entered when: ? the overcurrent time exceeds the maximum overcurrent fault time t fault(oc) or if the overcurrent occurs in more than half the number of cycles when v th(cp)min is reached ? if during boost or burn state, f bridge(max) is reached due to capacitive mode detection ? two consecutive failed lamp ignition attempts in power-down mode, the oscilla tor is stopped, the hs transi stor is non-conductive and the ls transistor is conductive. the v dd supply is internally clamped. the circuit is released from power-down mode by lo wering the low voltage supply below v dd(rst) (mains switch reset). an option is available which enables the ic to enter power-down mode using external logic. the external power-down option is only available when the ic is in the boost or burn state. the cp pin is used to enable the exte rnal power-down option. when the cp pin is connected using a 10 k ? resistor to the pgnd pin or the sgnd pin, v cp is pulled below v th(pd)cp . the ic then enters power-down mode. remark: do not connect the cp pin directly to pins pgnd or sgnd. always connect in series to pins pgnd or sgnd with a 10 k ? resistor. this action avoids the ic being not starting up because of excessive currents flowing during the reset and start-up states. uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 17 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 8. limiting values table 3. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit general r ext(rref) external resistance on pin rref fixed nominal value 33 k ? 30 36 k ? sr slew rate on pins hbo with respect to pgnd ? 4+4v/ns t j junction temperature ? 40 +150 ?c t amb ambient temperature p = 0.8 w ? 40 +85 ?c t stg storage temperature ? 55 +150 ?c currents i i(cf) input current on pin cf 0 200 ? a i dm peak drain current uba20261; hs; t j uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 19 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 10. characteristics table 5. characteristics v dd =13 v; v fs ? v hbo =13 v; t amb = 25 ? c; settings according to default setting (see table 6 on page 26 ), all voltages referenced to pgnd and sgnd, positive currents flow into the uba20261/2, unless otherwise specified. symbol parameter conditions min typ max unit start-up state pin v dd v dd(rst) reset supply voltage hs switch = off; ls switch = on 5.7 6.2 6.7 v v dd(stop) stop supply voltage 9.6 10 10.4 v v dd(start) start supply voltage 11.9 12.4 12.9 v v dd(hys) hysteresis of supply voltage start-stop 2.2 2.4 2.6 v v dd(clamp) clamp supply voltage i dd(clamp) = 5 ma 13 13.4 13.8 v i dd(clamp) clamp supply current v dd(clamp) = 14 v 20 30 - ma i dd(startup) start-up supply current v dd = 9 v - 190 220 ? a i dd(pd) power-down supply current v dd = 9 v - 190 220 ? a i dd supply current default setting; v ci =v ci(clamp) ; v cb =0v [1] -1.62ma high-voltage supply pins dhs, hbo and fs i leak leakage current uba20261: 300 v on high-voltage pins --30 ? a uba20262: 500 v on high-voltage pins --30 ? a voltage controlled oscillator output pin ci v ci(max) maximum voltage on pin ci 2.7 3 3.3 v v hr(ci) headroom voltage on pin ci v clamp(ci) = v hr(ci) +v ci(max) ; burn and boost state -80-mv output pin cf f bridge(min) minimum bridge frequency c cf = 100 pf; v ci = v clamp(ci) ; v cb =0v [2] 38 40 42 khz f bridge(max) maximum bridge frequency c cf = 100 pf; v ci = 0 v [2] 88 100 112 khz f bridge(bst)min minimum boost bridge frequency c cf = 100 pf; v ci = v clamp(ci ) [2] 21 22 23 khz t no non-overlap time v hbo rising edge 1.3 1.5 1.7 ? s v hbo falling edge 1.3 1.5 1.7 ? s v th(cf)max maximum threshold voltage on pin cf c ext(cf) = 100 pf; v ci =v clamp(ci) ; v cb =0v 2.4 2.5 2.6 v i o(bst)cf boost output current on pin cf v cf =1.5v; v cb =v clamp(ci ) ? 12.3 ? 11.8 ? 11.3 ? a i o(cf)min minimum output current on pin cf v cf =1.5v; v cb =0v; v ci =v clamp(ci ) ? 22.8 ? 21.8 ? 20.8 v i o(cf)max maximum output current on pin cf v cf =1.5v; v cb =0v ? 67 ? 60 ? 53 ? a uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 20 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls power transistors r on on-state resistance uba20261: hs; i dhs = 1.1 a; t j =25 ? c-11.3 ? ls; i hbo = 1.1 a; t j =25 ? c-11.3 ? uba20262: hs; i dhs = 1.1 a; t j = 25 ? c-33.6 ? ls; i hbo = 1.1 a; t j =25 ? c-33.6 ? r on(150) /r on(25) on-state resistance ratio (150 ? c to 25 ?c) r on at t j =150 ?c/r on at t j =25 ?c -1.7- boot strap diode v f forward voltage bootstrap diode; i fs =5ma; (v f =v dd -v fs ) 1.3 1.7 2.1 v preheat current sensor input pin sls i i(sls) input current on pin sls v i(sls) =0.4v - - 1 ? a v ph(sls) preheat voltage on pin sls [3] 0.57 0.60 0.63 v output pin ci i o(source)ci source output current on pin ci v ci =2v; v i(sls) <0.6v ? 10.6 ? 9.6 ? 8.6 ? a i o(sink)ci sink output current on pin ci v ci =2v; v i(sls) <0.6v 26 29 32 ? a preheat timer, ignition time r and overcurrent fault timer t ph preheat time c cp = 470 nf; r ext(rref) = 33 k ? -0.93-s t en(ign) ignition enable time c cp = 470 nf; r ext(rref) = 33 k ? -0.22-s t fault(oc) overcurrent fault time c cp = 470 nf; r ext(rref) = 33 k ? ; initial voltage v cp =5v -0.1-s t ret(dim) dimming retention time c cp = 470 nf; r ext(rref) = 33 k ? ; initial voltage v cp =5v -2.8-s i o(cp) output current on pin cp v cp = 4.1 v; source ( ? ); sink (+) 5.5 5.9 6.3 ? a i ret(dim)cp dimming retention current on pin cp current into pin cp; v dd =0v; initial v cp = 5 v -0.5- ? a v th(cp)min minimum threshold voltage on pin cp v cf =0v, v ci =2v - 3.8 - v v th(cp)max maximum threshold voltage on pin cp v cf =0v, v ci =2v - 4.5 - v v hys(cp) hysteresis voltage on pin cp 0.6 0.7 0.8 v i pu(cp) pull-up current on pin cp v cp = 3.8 v - ? 60 - ? a v ret(dim)cp dimming retention voltage on pin cp v dd =0v - 2 - v v th(pd)cp power-down threshold voltage on pin cp burn state; 10 k ? connected in series -1-v v th(rel)cp release threshold voltage on pin cp hold state - 2.7 - v table 5. characteristics ?continued v dd =13 v; v fs ? v hbo =13 v; t amb = 25 ? c; settings according to default setting (see table 6 on page 26 ), all voltages referenced to pgnd and sgnd, positive currents flow into the uba20261/2, unless otherwise specified. symbol parameter conditions min typ max unit uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 21 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls boost timer pin cb t bst boost time c cb = 470 nf; t j <80 ?c - 148 - s i o(cb) output current on pin cb v cb = 2.35 v; source ( ? ); sink (+) 0.8 1 1.2 ? a v th(cb)min minimum threshold voltage on pin cb -1.1-v v th(cb)max maximum threshold voltage on pin cb -3.6-v v hys(cb) hysteresis voltage on pin cb 2.3 2.5 2.7 v t j(bp)bst boost bypass junction temperature t j sensed at end of ignition time 65 80 95 ? c t j(end)bst boost end junction temperature t j during boost time 105 120 135 ? c i det(dis)bst boost disable detection current v cb =0v ? 30 ? 25 ? 20 ? a t t(bst-burn) transition time from boost to burn c cp = 470 nf; t j <80 ? c-3 . 6 -s pin csi n lcbr lamp current boost ratio v i(csi) in boost state versus v i(csi) in burn state; default start-up state (no dimming) 1.4 1.5 1.6 v coil saturation protection and overcurrent detection input: pin sls v th(sat)sls saturation threshold voltage on pin sls ignition state; r lsat = 47 k ? 1.10 1.18 1.25 v v th(ocp)sls overcurrent protection threshold voltage on pin sls ignition state; r lsat = 47 k ? 1.10 1.18 1.25 v t leb leading edge blanking time detection disabled for first part of gls time - 800 - ns input: pin lsat: i source(lsat) source current on pin lsat v lsat =1.2v ? 26.3 ? 25 ? 23.7 ? a v clamp(lsat) clamp voltage on pin lsat r lsat = ?;c lsat = 1 nf 2.3 2.5 2.7 v output pin ci i o(sink)ci sink output current on pin ci v ci = 2 v; v i(sls) > v th(sat)sls ; cycle clocked 26 29 32 ? a output: pin cf: ? i o(sat)cf saturation output current difference on pin cf v cf = 1.5 v; ignition state; ls switch = on -160- ? a ignition current detection input pin csi v th(det)ign(csi) ignition detection threshold voltage on pin csi [3] 0.55 0.6 0.65 v t w(det)ign(min) minimum ignition detection pulse width v th(det)ign(csi) = 0.75 v square pulse 685 885 1085 ns table 5. characteristics ?continued v dd =13 v; v fs ? v hbo =13 v; t amb = 25 ? c; settings according to default setting (see table 6 on page 26 ), all voltages referenced to pgnd and sgnd, positive currents flow into the uba20261/2, unless otherwise specified. symbol parameter conditions min typ max unit uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 22 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls [1] see table 6 on page 26 for the default setting. [2] the half-bridge output switching frequency (hbo). t he saw-tooth frequency on pin cf is twice as high. [3] data sampling of v ph(sls) is performed at the end of the ls power mosfet conduction period in preheat state. [4] data sampling of v th(capm)sls is performed at the start of conduction of the ls pow er mosfet, in all states with oscillator active. capacitive mode detection input pin sls v th(capm)sls capacitive mode threshold voltage on pin sls [4] ? 15 ? 50 mv output pin ci i o(sink)ci sink output current on pin ci v i(sls) > v th(capm)sls ; v ci = 2 v; ignition state or boost and burn state 26 29 32 ? a lamp current sensor and dimming control input pin csi r i(csi) input resistance on pin csi v i(csi) = 1 v 1 - - m ? v i(csi) = ? 1 v 40 50 60 k ? v i(csi) input voltage on pin csi rectification linear for operation ? 2.5 - +2.5 v minimum dim level; r ext(rref) =33k ? ; r mdl =2k ? 44 50 56 mv v clamp(csi) clamping voltage on pin csi rms voltage; clamp active; default start-up burn state; 100 % on -1-v ? v dim2(csi) dimming 2 voltage difference on pin csi rms voltage; offset from v i(csi) at dim_2 compared to mdl 330 350 370 mv ? v dim3(csi) dimming 3 voltage difference on pin csi rms voltage; offset from v i(csi) at dim_3 compared to mdl 90 100 110 mv output pin ci i o(ci) output current on pin ci burn state; source and sink; v ci = 2 v; source ( ? ) and sink (+) 85 95 105 ? a input pin mdl (minimum dimming level) i source(mdl) source current on pin mdl ? 26.3 ? 25 ? 23.7 ? a v mdl voltage on pin mdl r ext(rref) = 33 k ? ; r mdl = 2 k ? -50-mv temperature protection t j(otp) overtemperature protection junction temperature 145 160 170 ?c t j(otp)hys hysteresis overtemperature protection junction temperature 10 20 30 ?c input pin csi v otp(csi) overtemperature protection voltage on pin csi rms voltage; r ext(rref) = 33 k ? ; r mdl =2 k ? ; t j >t j(opt) ? t j(hys)(otp) 380 400 420 mv table 5. characteristics ?continued v dd =13 v; v fs ? v hbo =13 v; t amb = 25 ? c; settings according to default setting (see table 6 on page 26 ), all voltages referenced to pgnd and sgnd, positive currents flow into the uba20261/2, unless otherwise specified. symbol parameter conditions min typ max unit uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 23 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 11. application information 11.1 design equations all described equations are only valid for r ext(rref) = 33 k ? . 11.1.1 c cp related timing equations ? preheat time (1) ? ignition enabling time (2) ? overcurrent fault time (3) ? transition to burn time (4) ? retain time step dimming (5) ? restart delay time (6) where i restart(cp) =0.5 ? a (typical). 11.1.2 c cb related timing equation ? boost time (7) t ph c cp i ocp ?? -------------- 16 v ? hys cp ?? 5v th cp ?? max ?+ ?? ? = t en ign ?? c cp i ocp ?? -------------- 4v hys cp ?? ?? = t fault oc ?? c cp i ocp ?? -------------- 5v th cp ?? min ? ?? ? = t t bst burn ? ?? c cp i ocp ?? -------------- 64 v hys cp ?? 5v th cp ?? max ?+ ? ?? ? = t ret dim ?? c cp i ret dim ?? cp ------------------------- 5v ret dim ?? cp ? ?? ? = t drestart ?? c cp v th cp ?? max v th rel ?? cp ? ?? i restart cp ?? ------------------------------------------------------------ - ? = t bst c cb i ocb ?? -------------- 126 v hys cb ?? v th cb ?? min 0.6 ? + ? ?? ? = uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 24 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 11.1.3 c (cf) related frequency equations ? maximum bridge frequency (8) where c par = 4.7 pf and t dch = 0.4 ? s. ? minimum bridge frequenc y with disabled boost (9) ? minimum bridge frequency with enabled boost (10) 11.1.4 r sls related preheat current (11) (12) 11.1.5 r mdl related minimum dimming level ? mdl threshold voltage (13) 11.1.6 r lsat related saturation and overcurrent threshold level ? saturation threshold voltage (14) f bridge max ?? 0.5 c cf c par + i ocf ?? max --------------------------- v th cf ?? max t dch + ? --------------------------------------------------------------------------- - = f bridge min ?? 0.5 c cf c par + i ocf ?? min --------------------------- v th cf ?? max t dch + ? --------------------------------------------------------------------------- - = f bridge bst ?? min 0.5 c cf c par + i obst ?? cf --------------------------- v th cf ?? max t dch + ? --------------------------------------------------------------------------- - = i ph m ?? v ph sls ?? r sls ------------------- - = i ph rms ?? v ph sls ?? r sls 3 ? ------------------------ - ? v mdl r mdl i source mdl ?? ? = v th sat ?? sls v th ocp ?? sls r lsat i source lsat ?? ? == uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 25 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 11.2 application diagram detailed in ta b l e 6 is a list of typical application components. see figure 12 . fig 12. uba20261/2 default application diagram 001aao277 r1 r9 l1 c3 c17 c15 c16 r8 d5 d6 c1 c5 d1 d3 d2 r csi r5 r6 r sls r lsat r mdl r ref c cb c cp c cf c lsat c4 d4 c2 c9 c10 d7 c13 c12 c8 l2 c11 c6 d8 dhs fs hbo hbo ghs gls v dd sls sls csi n.c. pgnd cfl uba20261/2 sgnd cb 18 16 17 20 19 11 3 2 1 6 9 7 8 4 10 13 14 12 515 cp ci mdl rref cf lsat sls hbo c7 uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 26 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls table 6. typical application components a 230 v (ac) mains application reference component description uba20261 uba20262 r1 4.7 ?? 10 ?? 2 w fusible resistor r5, r6 120 k ? 220 k ? r8 560 ? 2.2 k ? r9 1 k ? 1 k ? r ref 33 k ? ; 1 % 33 k ? ; 1 % r sls 1 ? 1.2 ? adjust for preheat current r mdl 1 k ? 1 k ? adjust for minimum lamp current r csi 6.19 ? 6.19 ? adjust for nominal lamp current r lsat 100 k ? 100 k ? c1 47 nf; 400 v 47 nf; 630 v c2 22 nf; 400 v 22 nf; 630 v c3 47 nf; 250 v 47 nf; 400 v c4 22 ? f; 250 v 6.8 ? f; 400 v c5 6.8 nf; 1 kv 4.7 nf; 1 kv lamp capacitor c6 68 nf; 250 v 68 nf; 250 v c7 100 pf 100 pf c8 22 nf; 400 v 47 nf; 400 v c9 560 pf; 500 v 560 pf; 500 v v dd charge pump capacitor c10 not mounted not mounted c11 68 nf; 250 v 68 nf; 250 v c12 100 nf 100 nf c13 470 nf 470 nf c15 220 nf 220 nf c16 not mounted not mounted c17 220 nf; 400 v 220 nf; 400 v c cb 150 nf 150 nf c cp 330 nf 330 nf c cf 100 pf; 2 % 100 pf; 2 % c lsat 1 nf 1 nf d1 to d4 1n4007 1n4007 d5; d6 1n4937 1n4937 d7 bzx84jc12 bzx84jc12 d8 bas20 bas20 l1 4.7 mh 4.7 mh mains filter inductor; i sat =300 ma l2 wrth elektronik: 760800031 wrth elektronik : 7608000902 respectively: 1000/1.3/1.3 / 22 ? h and 2000/1.3/1.3/ 22 ? h lamp inductor uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 27 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 12. package outline fig 13. package outline sot163-1 (so20) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z ywv references outline version european projection issue date iec jedec jeita mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 sot163-1 10 20 w m b p detail x z e 11 1 d y 0.25 075e04 ms-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale x a a 1 a 2 h e l p q e c l v m a (a ) 3 a so20: plastic small outline package; 20 leads; body width 7.5 mm sot163-1 99-12-27 03-02-19 uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 28 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 13. abbreviations table 7. abbreviations acronym description cfl compact fluorescent lamp cmp capacitive mode protection dsr double-sided rectifier esd electrostatic discharge hs high-side ls low-side mdl minimum dimming level ocp overcurrent protection opp overpower protection ota operational transconductance amplifier otp overtemperature protection rms root mean square sr slew rate uvlo undervoltage lockout vco voltage controlled oscillator uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 29 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 14. revision history table 8. revision history document id release date data sheet status change notice supersedes uba20261_uba20262 v. 2 20111010 product data sheet - uba20261_uba20262 v. 1 uba20261_uba20262 v. 1 20110909 preliminary data sheet - - uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 30 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 15.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 15.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification. uba20261_uba20262 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved . product data sheet rev. 2 ? 10 october 2011 31 of 32 nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 15.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 16. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com nxp semiconductors uba20261/2 600 v and 350 v power ic for step dimmable cfls ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 10 october 2011 document identifier: uba20261_uba20262 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 half-bridge features . . . . . . . . . . . . . . . . . . . . . 1 2.2 preheat and ignition features . . . . . . . . . . . . . . 1 2.3 lamp boost features . . . . . . . . . . . . . . . . . . . . . 1 2.4 dim features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.5 protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.6 other features. . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 5 7.1 lamp start-up cycle . . . . . . . . . . . . . . . . . . . . . 6 7.1.1 reset state . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.1.2 start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.1.3 preheat state . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.1.4 ignition state . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.1.5 boost state and transition to burn state . . . . . . 8 7.1.6 burn state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.1.7 hold state . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.2 oscillation and timing . . . . . . . . . . . . . . . . . . . 11 7.2.1 oscillator control . . . . . . . . . . . . . . . . . . . . . . . 11 7.2.2 combined timing circuit . . . . . . . . . . . . . . . . . 11 7.3 step dimming . . . . . . . . . . . . . . . . . . . . . . . . . 12 7.4 protection functions and power-down mode . 14 7.4.1 coil saturation protection . . . . . . . . . . . . . . . . 14 7.4.2 overcurrent protection . . . . . . . . . . . . . . . . . . 15 7.4.3 overpower protection . . . . . . . . . . . . . . . . . . . 15 7.4.4 capacitive mode protection . . . . . . . . . . . . . . 15 7.4.5 overtemperat ure protection . . . . . . . . . . . . . . 16 7.4.6 power-down mode . . . . . . . . . . . . . . . . . . . . . 16 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17 9 thermal characteristics . . . . . . . . . . . . . . . . . 18 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 19 11 application information. . . . . . . . . . . . . . . . . . 23 11.1 design equations . . . . . . . . . . . . . . . . . . . . . . 23 11.1.1 c cp related timing equations . . . . . . . . . . . . . 23 11.1.2 c cb related timing equation . . . . . . . . . . . . . . 23 11.1.3 c (cf) related frequency equations . . . . . . . . . 24 11.1.4 r sls related preheat current. . . . . . . . . . . . . . 24 11.1.5 r mdl related minimum dimming level. . . . . . . 24 11.1.6 r lsat related saturation and overcurrent threshold level . . . . . . . . . . . . . . . . . . . . . . . . 24 11.2 application diagram. . . . . . . . . . . . . . . . . . . . 25 12 package outline. . . . . . . . . . . . . . . . . . . . . . . . 27 13 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 28 14 revision history . . . . . . . . . . . . . . . . . . . . . . . 29 15 legal information . . . . . . . . . . . . . . . . . . . . . . 30 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 30 15.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 30 15.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 31 16 contact information . . . . . . . . . . . . . . . . . . . . 31 17 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 |
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